Dias 3DIP Survey at ArcWest’s Teeta Creek Project

March 5, 2024

DIAS is pleased to be a part of this exciting project with ArcWest Exploration Inc.
“The program, using Dias Geophysical’s distributed array deep IP (“DCIP”) survey system, should provide the first modern, high quality, and high-resolution 3-D resistivity and chargeability model of the subsurface below the stockwork zone.”